Der Nutzen sollte so gestaltet sein, dass die einzelnen Leiterplatten mittels Stege verbunden sind (umrissgefräste Leiterplatten). Die Stege in der Fräsnut werden über das Messer auf die Matrize gesetzt. Der Steg wird unter das Stanzmesser geschoben und somit werden die Leiterplatten aus dem Nutzen vereinzelt. In unserer Anwendung nutzen wir von dem Hersteller CAB, den Stegtrenner Hektor 2 für kleinere Losgrößen.
The demands placed on modern electronic devices are constantly increasing. As a result, printed circuit boards that are manufactured for electronic components must be used as efficiently as possible.
The small size of a PCB makes handling extremely difficult. To simplify processing, the PCBs are therefore combined into a so-called panel and processed or assembled. A panel is a rectangular base plate of a predetermined size. This panel can contain an arrangement of PCBs or just one PCB (single card with break-off edge). Various separation options are used to separate the PCBs from the panel or a single PCB with a break-off edge. The components soldered onto the PCB are not flexible, which means that breakage points or hairline cracks can quickly occur, causing the components to lose their functionality.
We can fall back on various depaneling processes to enable stress-free separation of the PCBs.
The panel should be designed in such a way that the individual PCBs are connected by means of bars (outline-milled PCBs). The webs in the milling groove are placed on the die via the knife. The bar is pushed under the punching knife and thus the PCBs are separated from the panel. In our application, we use the bar separator Hektor 2 from the manufacturer CAB for smaller batch sizes.
If you need small assemblies in a flexible design, this is usually the only option. The material is gradually removed layer by layer, which means that engravings can also be realized. Flexible contour guides are also no problem.
We use the machine from the manufacturer Schunk from the SAR-1300 series. This is for small to large batch sizes. Thanks to linear motor axes and modern control technology, the milling accuracy is +/- 0.1 millimeters. The milling dust produced is extracted directly at the milling head. The panels are fed in using two shuttle axes.
Both small and large panels and PCBs with scoring/scoring grooves are separated quickly and economically. The PCB is placed with the scoring groove on the linear knife and the rolling knife is pulled over the panel PCB manually or automatically. We use the two machines MAESTRO 3E and MAESTRO 4 from the manufacturer CAB.
With this machine, the blanks are cut using two wedge-shaped knives. The scoring/scoring groove is pushed between the blades, the upper blade is lowered and the lower blade remains stationary. The advantage of this process is the very low stress applied to the PCB with the components soldered to it during the cutting process.
